3 June 2018

The Université de Sherbrooke is a stakeholder in a new research program, Advanced Cooling, which will develop a new high-performance cooling technology for microelectronics.

The new technology is based on the immersion of electronics devices in a dielectric liquid – that does not conduct electrical current – to cool them and at the same time evacuate the heat produced.

The Natural Sciences and Engineering Research Council (NSERC), PROMPT, Systemex Energies, and Varitron Technologies are also involved in the project, resulting in $2.6M in global investments over three years.

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